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发布日期:2023-09-22 17:39浏览次数:
高频混压板可以是FR4和高频板材的混合,或者不同DK的高频板材的混合,这种电路板具有耐高温性能和优异耐辐射性,这种结构的高频电路板能够满足局部高频信号传输的要求,领智电路是一家专业提供TU872 PCB打样,TU872 PCB加工,TU872 PCB批量制作等一站式印刷电路板的生产厂家。TU-872  LK  is  based on a  high  performance  modified epoxy  FR-4  resin. This  material  is reinforced with  regular woven  E-glass and designed with  low dielectric constant and  low dissipation  factor  for  high  speed  low  loss  and  high  frequency  multilayer  circuit  board application. TU-872 LK material is suitable for environmental protection lead free process and also compatible with FR-4 processes. TU-872 LK laminates also exhibit excellent CTE, superior chemical resistance, thermal stability, CAF resistance, and toughness enhanced by an allyl network forming compound.
1. Applications
  •     Backpanel, High performance computing
  •     Line cards, Storage
  •     Servers, Telecom, Base station
  •     Office Routers
2. Performance and Processing Advantages
  •     Excellent electrical properties
  •     Dielectric constant less than 4.0
  •     Dissipation factor less than 0.010
  •     Stable and flat Dk/Df performance
  •     Compatible with most FR-4 processes
  •     Lead free process compatible
  •     Improved z-axis thermal expansion
  •    Anti-CAF capability
  •     Superior dimensional stability, thickness uniformity and flatness
  •     Excellent through-hole and soldering reliability
3. Industry Approvals
  •     IPC-4101E Type Designation : /29, /99, /101, /126
  •     IPC-4101E/126 Validation Services QPL Certified
  •     UL Designation - ANSI Grade: FR-4.0
  •     UL File Number: E189572
  •     Flammability Rating: 94V-0
  •     Maximum Operating Temperature: 130°C
4. Standard Availability
  •    Thickness: 0.002” [0.05mm] to 0.062” [1.58mm], available in sheet or panel form
  •     Copper Foil Cladding: 1/3 to 5 oz for built-up & double sides
  •     Prepregs: Available in roll or panel form
  •     Glass Styles: 106, 1080, 3313, 2116 and other prepreg grades are available upon request

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